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Handbook of Wafer Bonding
Engels
425
Hardcover
Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information.
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: 9783527326464
: Engels
: Hardcover
: 425
: januari 2012
: 932
: 246 x 177 x 24 mm.
: Materiaalkunde